Welcome to CCL-LAwave

Non-Destructive Testing of Surfaces with Laser Acoustics

LAwave is a non-destructive measurement system based on laser acoustics (surface acoustic wave or SAW analysis) that rapidly analyzes a material's stiffness and density with incredible accuracy even for ultra thin films. It is an efficient and sensitive method for testing thin films and material surfaces. LAwave is the only non-destructive measuring device that is sensitive to films less than 5 nanometers.

The LAwave technique can be applied for a wide variety of films with different mechanical properties. Application examples reach from soft low-k resist films for integrated circuits to super hard nanocoatings for computer hard disks. LAwave yields the Young's Modulus of thin films, which depends on the characteristic material properties. It provides information about the hardness, strength and porosity of the tested material. Furthermore, layer thickness can be determined.

A special use for LAwave technique is the damage depth characterization for semi-conductor wafers. LAwave can benefit a wide range of process development and quality control applications.

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